Bonding Wax Cleaning Powder

Product Name: Bonding Wax Cleaning Powder
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* Bonding Wax Cleaning Powder:

AVAILABLE OPTIONS

Tick to add to cart	Name	Sku	Summary	Quantity	Price
	Bonding Wax Cleaning Powder - 5ltrs	0CON-177	Non-solvent cleaning powder used as a heated diluted liquid in conjunction with 0CON-193 for demounting wafers from substrates.
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Description
Semiconductors	Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors. Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques. Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Description

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors. Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques. Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.